VF-5700 Vertical Furnace for 300-mm Wafers

This heat treatment system performs silicon wafer, IGBT, polyimide and thin wafer oxidation, diffusion and CVD. Since its height is less than 3000 mm, this model can be easily introduced. It features a short cycle time and high throughput.

Features

  • Mini batch, flexible 25 to 50 wafers batch processing
  • High throughput using a high-power heater with fast heat-up time
  • Equipped with an operator-friendly high performance control system
  • Compact size without stocker

Overview

This short cycle time, high throughput, vertical diffusion furnace processes 300-mm (12-inch) wafers in a mini batch of 25–50 wafers each. Since the stocker space is eliminated, its height is less than 3000 mm, making it easy to introduce. There are many cases where furnaces are introduced without stockers, so you can cut the stocker-related costs. Thanks to the LGO heater, the furnace exhibits superior temperature characteristics over a wide range from low to medium high temperatures. It is suitable for the heat treatment of IGBT, polyimide, thin wafers and other materials in addition to silicon wafers.

Specifications

Outer
dimension
W1250×D2000×H2850 mm
Heater High power LGO heater
Flat zone
length
500 mm
Wafer size
300 mm
Batch size 50 wafers
FOUP opner 2
Finger 5 wafers + single wafer
HOST communication HSMS/GEM300(Option)
Options Forced-cooling system
N2 load lock
Flat zone length 750 mm
(Batch size 75 wafers)

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