VF-3000H Vertical Furnace for Gate Insulating Film Formation

A vertical furnace enabling high-temperature processing, ideal for power device manufacturing. Supports oxynitriding and wafers of up to 8 inches in size. Features an automatic wafer transfer mechanism, and can be used for applications ranging from R&D to mass production.

Features

  • Supports lot sizes ranging from mini-batches to 50 wafers, and applications ranging from R&D to use on mass-production lines.
  • Supports a wide range of wafer sizes up to 8 inches.
  • Enables temperature monitoring in wafer vicinity.
  • The furnace interior features our proprietary metal-free construction.
  • Supports serial processing of different oxidizing/oxynitriding processes (wet/dry oxidizing, H2 annealing, NH3 nitriding, NO/N2O oxynitriding).
  • Chamber cleaning mechanism (option)

Overview

VF-3000H is a vertical furnace that can process lots ranging from mini-batches to 50 wafers, and a wide range of wafer sizes from 3 to 8 inches. Carefully selected hardware and control system features enable applications ranging from R&D to use on mass-production lines. The furnace interior features our proprietary metal-free construction. VF-3000H enables high-temperature processing, making it ideal for power device manufacturing. It can also perform oxynitriding.

Specifications

Operating temperature range 700 to 1,400°C
Supported wafer sizes 3 to 8 inches
Maximum lot size 50 wafers
Gases used N2, Ar, H2, NO, N2O, NH3
Options N2 load lock, chamber cleaning mechanism
Applications SiC power devices, oxynitriding, nitriding, oxidizing, R&D, mass production

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