VF-3000H Activation Annealing Furnace

A vertical furnace enabling ultra high-temperature processing, ideal for power device manufacturing. Supports 3- to 6-inch wafers and has an automatic wafer transfer mechanism. Can be used for applications ranging from R&D to mass production.

Features

  • Supports lot sizes ranging from mini-batches to 50 wafers, and applications ranging from R&D to use on mass-production lines.
  • Supports a wide range of wafer sizes from 3 to 6 inches.
  • The furnace interior features our proprietary metal-free construction.
  • Enables temperature monitoring in wafer vicinity.
  • An N2 load lock is provided as a standard feature.
  • High-throughput cassette-to-cassette transport
  • H2 atmosphere annealing with trench rounding is available as an option.

Overview

VF-3000H is a vertical furnace that can process lots ranging from mini-batches to 50 wafers, and a wide range of wafer sizes from 3 to 6 inches. Carefully selected hardware and control system features enable applications ranging from R&D to use on mass-production lines. The furnace interior features our proprietary metal-free construction. VF-3000H can process test devices (without wafer transfer), and supports ultra high-temperature activation annealing processes.

Specifications

Operating temperature range 700 to 1,850°C (700 to 1,800°C for H2 annealing)
Supported wafer sizes 3 to 6 inches
Maximum lot size 50 wafers
Gases used N2, Ar, H2 (option)
Applications SiC power devices, R&D, mass production, activation annealing

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